AUERSPERG, Jürgen
Angewandte Mikromesstechnik GmbH (AMIC)
AMIC Berlin
Berlin - Germany

MICHEL, Bernd
Micro Materials Center Berlin
im Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)
Berlin - Germany

Abstract
In the recent years reliability issues have become more and more important in microsystem technology and in microelectronics. The thermal misfit between different materials has been shown to be responsible for more than 60 percent of all failure reasons of microcomponents. Therefore, crack and fracture avoidance strategies have become very important to achieve the breaktrough of advanced microsystem technologies in various applications.
The session deals both with simulation an experimental investigations with small components and microsystems as well. Modern crack and fracture concepts will be discussed taking into account the specific area of applications on the micro scale (and particularly also in the micro-nano transition region). Application of fracture, crack and fatigue problems in microelectronic and microsystem packaging will also be touched. Creep cracks and thermal fatigue cracks in microsystems interconnect regions, microsolders, surface-near and interface-near regions of microsystems and microcomponents will be concerned. Special attention will be given to practical applications of modern fracture mechanis in various fields, e.g. in IT, automotives, space applications, and many other fields of microsystems containing chips and other microcomponents.
Problems of reliability and life-time estimations of microsystems based on modern concepts of stress, strain and fracture analysis will be special topics of the session. The influence of mechanical, electrical, thermal, diffusion and other interacting fields on the crack and fracture phenomena of microcomponents and microsystems will be considered, too.